Alloy: 63Sn/37Pb, 62Sn/36Pb/2Ag, 42Sn/58Bi*
ALPHA UP-78 is a No Clean solder paste with a post-reflow residue that is clear and colorless and is penetrable enough to allow easy ATE compatibility (pin testability). The residue is engineered to be soft and non-tacky to allow the lowest level of false rejects during pin testing. ALPHA UP-78 is designed for stencil application and air reflow in surface mounting processes where post reflow cleaning is not required
Packing: bulk
Product number: 117716
out of stock
© 2024 https://www.giga-tel.com